Micro Materials Inc. (MMI) is a cutting-edge technology company dedicating to developing innovative wafer handling and processing yield improvement solutions for fan-out wafer level packaging, 3D vertical IC integration, and advanced packaging for MEMS, LED and CMOS image sensors.
Our patented AirDebond® technology allows for fast and low stress debonding down to less than 15 µm. The flow of air between the carrier and device presses the device downward, and lifts the carrier up from underneath, resulting in the most uniform stress distribution. Currently, MMI is the only company in the world providing 400°C temporary bonding solutions, which also enables thin wafer debonding through low stress air jetting.
Our protective coatings simultaneously provide the wafer/device extra protection from dicing, debris/silicon dusts, and side cracks. Our water soluble Z-Coat 100 coating is designed to withstand high temperature for temporarily protecting wafer/bump surface in laser dicing/drilling and other process handling, and can be easily removed with di-water even after 400°C bake.
Our water-resistant Z-Coat 122 can protect wafer/bump surface in mechanical wafter dicing, and can be completely removed by spray-soaking our water-based cleaner Z-Clean 820C, followed by di-water rinse.
To best serve our customer demands, Micro Materials Inc. has established a full set of application and service capabilities in house. Customers can evaluate equipment, material, and all other aspects of the technology at MMI.